DocumentCode :
27493
Title :
Kinetics of Buffer-Related RON-Increase in GaN-on-Silicon MIS-HEMTs
Author :
Bisi, Davide ; Meneghini, Matteo ; Marino, Fabio Alessio ; Marcon, Denis ; Stoffels, Steve ; Van Hove, Marleen ; Decoutere, Stefaan ; Meneghesso, Gaudenzio ; Zanoni, Enrico
Author_Institution :
Dept. of Inf. Eng., Univ. of Padova, Padua, Italy
Volume :
35
Issue :
10
fYear :
2014
fDate :
Oct. 2014
Firstpage :
1004
Lastpage :
1006
Abstract :
This letter reports an extensive analysis of the charge capture transients induced by OFF-state bias in double heterostructure AlGaN/GaN MIS- high electron mobility transistor grown on silicon substrate. The exposure to OFF-state bias induces a significant increase in the ON-resistance (Ron) of the devices. Thanks to time-resolved on-the-fly analysis of the trapping kinetics, we demonstrate the following relevant results: 1) Ron-increase is temperature- and field-dependent, hence can significantly limit the dynamic performance of the devices at relatively high-voltage and high temperature (100 °C-140 °C) operative conditions; 2) the comparison between OFF-state and back-gating stress indicates that the major contribution to the Ron-increase is due to the trapping of electrons in the buffer, and not at the surface; 3) the observed exponential kinetics suggests the involvement of point-defects, featuring thermally activated capture cross section; and 4) trapping-rate is correlated with buffer vertical leakage-current and is almost independent to gate-drain length.
Keywords :
III-V semiconductors; MISFET; aluminium compounds; electron traps; elemental semiconductors; gallium compounds; high electron mobility transistors; leakage currents; point defects; silicon; wide band gap semiconductors; AlGaN-GaN-Si; OFF-state bias; ON-resistance; back-gating stress; buffer vertical leakage current; charge capture transients; double heterostructure MIS-high electron mobility transistor; electron trapping; point defects; temperature 100 degC to 140 degC; trapping kinetics; Aluminum gallium nitride; Charge carrier processes; Gallium nitride; Kinetic theory; Silicon; Stress; Substrates; GaN; HEMT; current collapse; dynamic RON; temperature; temperature.; trapping;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2014.2344439
Filename :
6878414
Link To Document :
بازگشت