Via design in multi-layer PCB

Author

Du Meizhu ; Li Shufang ; Qiu Xiaofeng

Author_Institution

Beijing Univ. of Posts & Telecommun., China

fYear

2003

fDate

4-7 Nov. 2003

Firstpage

94

Lastpage

98

Abstract

Vias between routing layers induce interconnection discontinuities. Signal reflection on the track is enhanced because of these discontinuities. A via is a noise source as the signal frequency increases. The reflection fraction changes with the via geometry properties, especially via height. The paper focuses on the influence of via height on signal reflection. Via heights from 250 /spl mu/m to 1500 /spl mu/m are studied under high frequency by simulation. The reflection loss caused by a via increases with via height nonlinearly. Considering the reflection, an optimization criterion for via design is provided.

Keywords

interconnections; printed circuit layout; random noise; reflection; 250 to 1500 micron; interconnection discontinuities; multilayer PCB; noise source; optimization criterion; reflection fraction; routing layers; signal reflection; via design; via geometry; Acoustic reflection; Design optimization; Dielectric materials; Finite difference methods; Frequency; Geometry; Integrated circuit interconnections; Microstrip; Telecommunications; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmental Electromagnetics, 2003. CEEM 2003. Proceedings. Asia-Pacific Conference on

Conference_Location

Hangzhou, China

Print_ISBN

7-5635-0802-3

Type

conf

DOI

10.1109/CEEM.2003.238594

Filename

1282252