The influence of different PCB materials on the coupling behavior of high power electromagnetics

For the development and protection of electronic systems, which may be used in a high power electromagnetic (HPEM) environment, the behavior concerning the coupling of electromagnetic pulses is of special interest. Due to the use of different PCB materials, especially for RF applications, the influence of the used substrates on the coupling behavior of HPEM pulses for microstrip lines is investigated in this contribution. The results are to assess statements about the boundary of a linear coupling behavior and the expected coupled signals into PCB structures in complex systems under HPEM conditions.