Progress towards a combined CIM/MoM approach for EMI analysis of electronic systems

This paper presents a multi-step approach for the modeling of radiated emissions of electronic systems. Due to the high complexity and high aspect ratio of the inner structures of a printed circuit board (PCB), full wave modeling of a system including the external environment and enclosures is usually unrealistic. In this multi-step approach, the system is decomposed into internal and external domains by the PCB surfaces. The interior domain is first solved using the contour integral method to obtain equivalent surface currents, which serve as excitations for the method of moments to solve the external domain. Here, we focus on the radiation from the board edges by assuming solid plates on both upper and lower sides of the PCB. Various configurations will be analyzed to study the impact of exterior structures on the radiated emission of the system. The impact of the coupling from the scattered field back to the PCB will be discussed.