DocumentCode
2749777
Title
Design for Environment in New Semiconductor Manufacturing Technologies
Author
Harland, John ; Harman, David ; Drago, Len
Author_Institution
Intel Corp., Hillsboro
fYear
2007
fDate
7-10 May 2007
Firstpage
91
Lastpage
96
Abstract
In this paper, we provide data on the environmental performance improvements achieved during the conversion from manufacturing semiconductors on 200 mm silicon wafer to manufacturing on 300 mm. Conclusions identify approaches to continue the environmental improvements in future manufacturing generations.
Keywords
design for environment; environmental management; integrated circuit manufacture; design for environment; environmental performance improvements; future manufacturing generations; semiconductor manufacturing technologies; silicon wafer; size 200 mm; size 300 mm; Manufacturing industries; Manufacturing processes; Microprocessors; Moore´s Law; Production facilities; Pulp manufacturing; Research and development; Semiconductor device manufacture; Silicon; Water conservation; 300mm wafer; Environmental performance; Silicon wafer; emission factor; microprocessor; semiconductor tools; water conservation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics & the Environment, Proceedings of the 2007 IEEE International Symposium on
Conference_Location
Orlando, FL
ISSN
1095-2020
Print_ISBN
1-4244-0861-X
Type
conf
DOI
10.1109/ISEE.2007.369373
Filename
4222862
Link To Document