Quantification of thermal contact conductance in electronic packages

Author

Childres, S. ; Peterson, G.P.

Author_Institution

Dept. of Mech. Eng., Texas A&M Univ., College Station, TX, USA

fYear

1989

fDate

7-9 Feb. 1989

Firstpage

30

Lastpage

36

Abstract

Results of an investigation are presented in which a numerical technique was used to predict interface pressures. Combining these predicted pressures and the results of previous investigations, the individual thermal contact resistances and overall package resistance were determined for an 18 plastic dual-in-line package (PDIP) constructed from typical, commercially available materials. The results indicate that the summation of the contact resistances can comprise as much as 43% of the total package thermal resistance for the packages investigated.<>

Keywords

contact resistance; finite element analysis; numerical methods; packaging; contact resistances; electronic packages; finite element model; interface pressures; numerical technique; package resistance; plastic dual-in-line package; thermal contact conductance; Conducting materials; Contact resistance; Electronic packaging thermal management; Heat transfer; Lead; Semiconductor device packaging; Surface resistance; Thermal conductivity; Thermal engineering; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE

Conference_Location

San Diego, CA, USA

Type

conf

DOI

10.1109/STHERM.1989.76062

Filename

76062