Title :
Influence of IGBT-module switching characteristics to radio frequency noise
Author :
Domurat-Linde, André ; Lang, Klaus Dieter ; Hoene, Eckart
Author_Institution :
Div. Syst. Design & Integration, Fraunhofer IZM, Berlin, Germany
Abstract :
The presented paper investigates the relationship between high frequency oscillations created in power modules and their radio frequency noise emission. It is shown that high frequency oscillations with slew rates comparable or higher than the ones generated by the used semiconductors leads to significant higher noise emission in the radio frequency range. During turn on of the IGBT a high frequency oscillation is created between the stray inductances of the DC-Link and the reverse capacitances of the blocking freewheeling diodes. The DC-Link stray inductances are charged by the reverse recovery current of the freewheeling diode. When the reverse recovery current peak is passed the diode begins to block and the energy stored in the inductances oscillates to the reverse capacitance of the diode. The quality of the oscillation is mainly influenced by the tailing of the diodes reverse recovery current. At the investigated three phase, 600V, 200A power module the observed turn on resonance frequency is 33MHz. The crucial characteristic of this phenomenon is that the noise emission is not only higher at the resonance but for all frequency above, too. By reducing the module inductances the resonances are shifted to higher frequencies but measurements show that the emitted spectrum stays the same. To reduce the module inductances do not solve the problem. The results of the investigation enable the design of power modules with reduced radiated emissions.
Keywords :
insulated gate bipolar transistors; oscillations; semiconductor diodes; DC-link stray inductance; IGBT-module switching characteristic; blocking freewheeling diode; current 200 A; diodes reverse recovery current; frequency 33 MHz; high frequency oscillation; module inductance; power module; radio frequency noise emission; reverse capacitance; reverse recovery current peak; slew rate; voltage 600 V; Insulated gate bipolar transistors; Multichip modules; Noise; Oscillators; Resonant frequency; Semiconductor device measurement; Semiconductor diodes; EMI; High Frequency Oscillation; Power Electronics; Power Module Design;
Conference_Titel :
Electromagnetic Compatibility (EMC EUROPE), 2012 International Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4673-0718-5
DOI :
10.1109/EMCEurope.2012.6396769