DocumentCode :
2751984
Title :
Current status and future trend on CAD tools for VLSI testing
Author :
Cheng, Wu-Tung
Author_Institution :
Mentor Graphics Corp., Wilsonville, OR, USA
fYear :
2000
fDate :
2000
Firstpage :
10
Lastpage :
11
Abstract :
For current VLSI designs, there are two kinds of well-accepted digital testing technologies. One is for embedded memories and the other is for the logic. For embedded memories, Built-In-Self-Test (BIST) is used. For the logic, the main solutions are based on scan DFT and automatic test pattern generation (ATPG). However, to reduce the need to use an external tester, and to ease test reuse at the system level, more designs are using BIST to test logic. In the future, with system on chip (SoC) requirements and deep Sub-Micron (DSM) technologies, we believe that BIST and scan-based ATPG will continue to be the main solutions to VLSI testing. However, to be successful, some improvements are needed. The author discusses future trends in three categories: test quality, test application cost and test development effort
Keywords :
VLSI; automatic test pattern generation; built-in self test; circuit CAD; integrated circuit design; integrated circuit economics; logic testing; ATPG; BIST; CAD; SoC; VLSI design; VLSI testing; automatic test pattern generation; deep Sub-Micron technologies; embedded memories; scan-based ATPG; system on chip; test application cost; test development; test logic; test quality; Automatic logic units; Automatic test pattern generation; Built-in self-test; Design automation; Design for testability; Logic design; Logic testing; System testing; System-on-a-chip; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Symposium, 2000. (ATS 2000). Proceedings of the Ninth Asian
Conference_Location :
Taipei
ISSN :
1081-7735
Print_ISBN :
0-7695-0887-1
Type :
conf
DOI :
10.1109/ATS.2000.893593
Filename :
893593
Link To Document :
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