High heat flux cooling for silicon-on-silicon packaging

The authors report the first data on cooling of silicon substrates using pool boiling of Freon-12 and compare the results to liquid-jet impingement cooling of the same substrates. Heater fluxes of 2000 W/cm/sup 2/ at a maximum temperature rise of 50 K have been achieved using 16 jets impinging at 1 m/s. Pool boiling experiments have reached heater fluxes of 100 W/cm/sup 2/ with a 50 K temperature rise. Results from two-dimensional numerical simulation of the test section are in excellent agreement with the pool boiling data. These results indicate that both modes of cooling should be useful in cooling advanced packages. The authors demonstrate the use of monolithic integrated circuit fabrication techniques in the development of test sections for heat transfer measurements. A double-sided integrated circuit process has been used to fabricate a novel isothermal test section for direct measurement of heat transfer coefficients.<>