Title :
Prediction of electronic component temperatures at high altitude using low altitude measurements
Author_Institution :
IBM Corp., Austin, TX, USA
Abstract :
Analytical predictions of developing-flow, forced-air-cooled electronic component temperatures at high altitudes using near-sea-level temperature measurements are compared with the results of experiments performed at 198 m (650 ft) and 1646 m (5400 ft) above sea level. The correlation derived does not agree with correlations in the literature for fully developed laminar or turbulent two-dimensional flow over a constant-temperature flat plate, but predictions fall within +or-3.8% and -1.1% of measured temperatures, respectively. Altitude correction factors for ambient air preheat and module thermal resistances measured at 198 m are determined for 915 m (3000 ft), 1646 m (5400 ft), and 2135 m (7000 ft). An example of temperature prediction for 2135 m based on measurements made at 198 m is presented.<>
Keywords :
cooling; electronic equipment testing; heat sinks; heat transfer; turbulence; 1646 m; 198 m; 2135 nm; 915 m; altitude correction factors; constant-temperature flat plate; correlation; electronic component temperatures; forced-air-cooled electronic component temperatures; high altitude performance; laminar flow; low altitude measurements; module thermal resistances; near-sea-level temperature measurements; temperature prediction; thermal testing; turbulent two-dimensional flow; Electrical resistance measurement; Electronic components; Fluid flow measurement; Ocean temperature; Performance analysis; Performance evaluation; Sea level; Sea measurements; Temperature measurement; Thermal factors;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/STHERM.1989.76076