Thermally conductive aluminium nitride-filled epoxy resin (for electronic packaging)

Author

Bujard, P. ; Ansermet, J.P.

Author_Institution

Giba-Geigy Ltd., Fribourg, Switzerland

fYear

1989

fDate

7-9 Feb. 1989

Firstpage

126

Lastpage

130

Abstract

The thermal conductivity and the relative permittivity of an AlN particulate-filled epoxy resin have been investigated as a function of the volume loading ratio of AlN and the temperature. A thermal conductivity of 4 W/mK has been achieved. The observed thermal conductivities depend on the overall statistics of the particle arrangement in the epoxy matrix. An analysis led the authors to assumed the presence of clusters of AlN in the epoxy matrix. The temperature dependence of the thermal conductivity can be deduced from the room temperature of the thermal conductivity and the measured coefficients of thermal expansion.<>

Keywords

aluminium compounds; filled polymers; packaging; permittivity measurement; thermal conductivity measurement; AlN; AlN filled epoxy resin; clusters; epoxy matrix; relative permittivity; statistics; temperature dependence; thermal conductivity; thermal expansion; volume loading ratio; Aluminum; Conductivity measurement; Electronic packaging thermal management; Electronics packaging; Epoxy resins; Temperature dependence; Thermal conductivity; Thermal expansion; Thermal loading; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE

Conference_Location

San Diego, CA, USA

Type

conf

DOI

10.1109/STHERM.1989.76077

Filename

76077