Title :
300 A delta VF tester
Author_Institution :
Motorola Inc., Phoenix, AZ, USA
Abstract :
A description is given of the design and development of a relatively low-cost, high-current, transient-thermal-resistance tester. Using delta techniques, the tester was initially used to measure the die bond integrity of large power-handling rectifier assemblies, but because of its versatility it can thermally characterize most semiconductor junctions. Circuit design details and testing of several products are illustrated, including V/sub F/ (forward voltage) and Delta V/sub V/ measurements of power rectifiers and smart power ICs.<>
Keywords :
electronic equipment testing; integrated circuit testing; power integrated circuits; rectifiers; test equipment; thermal resistance measurement; transients; 300 A; delta techniques; die bond integrity; forward voltage; power rectifiers; rectifier assemblies; semiconductor junctions; smart power ICs; transient-thermal-resistance tester; Bonding; Circuit testing; Electrical resistance measurement; Heating; MOSFETs; Power measurement; Rectifiers; Semiconductor diodes; Thermal resistance; Voltage;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/STHERM.1989.76080
