DocumentCode
2753706
Title
Real time in-situ monitoring and characterization of production wafer probing process
Author
Quach, Minh ; Harper, Kim
Author_Institution
Hewlett Packard Integrated Circuit Bus. Div., Corvallis, OR, USA
fYear
1997
fDate
1-6 Nov 1997
Firstpage
802
Lastpage
808
Abstract
This paper introduces a new technique that enables real-time monitoring and characterization of a production wafer probing process. Using this new technique, probing contact resistance data taken from production wafers has been correlated with wafer yield. Data are presented showing that production wafers are better suited for characterizing probing contact resistance than metalized setup wafers
Keywords
computerised monitoring; contact resistance; electric resistance measurement; integrated circuit testing; production testing; real-time systems; Delta V technique; contact resistance data; metalized setup wafers; probing; production wafer probing; real time in-situ monitoring; Circuit testing; Cleaning; Contact resistance; Debugging; Fabrication; Monitoring; Personnel; Probes; Production; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1997. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-4209-7
Type
conf
DOI
10.1109/TEST.1997.639694
Filename
639694
Link To Document