Thermal diagnostics of semiconductor devices

The ideal of complex investigation of the thermal performance of semiconductor devices is presented. Production diagnostics using thermal characteristics for the determination of packaging faults are discussed. The system under development is described. The system allows measurements of a device under test (DUT) in following modes: an individual test, which gives its thermal characteristics obtained from indirect electrical measurements; a train of tests for its safe operation area (SOA) boundary determination; and a diagnostics procedure which indicates the occurrence of a fault, its location, and probable reason for its occurrence during semiconductor device manufacture.<>