• DocumentCode
    2753962
  • Title

    Development of a MEMS testing methodology

  • Author

    Kolpekwar, Abhijeet ; Blanton, R. D Shawn

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    1997
  • fDate
    1-6 Nov 1997
  • Firstpage
    923
  • Lastpage
    931
  • Abstract
    Microelectromechanical systems (MEMS) are miniature electromechanical sensor and actuator systems developed from the mature batch-fabricated processes of VLSI technologies. Projected growth in the MEMS market requires significant advances in CAD and manufacturing for MEMS. These advances must be accompanied with testing methodologies that ensure both high quality and reliability. We describe our approach for developing a comprehensive testing methodology for a class of MEMS known as surface micromachined sensors. Our first step involving manufacturing process and low-level mechanical simulations is illustrated by studying the effects of realistic contaminations on the folded-flexure comb-drive resonator. The simulation results obtained indicate that realistic contaminations can create a variety of defective structures that result in a wide spectrum of faulty behaviors
  • Keywords
    micromachining; micromechanical devices; quality control; semiconductor device reliability; semiconductor device testing; MEMS testing methodology; batch-fabricated processes; defective structures; electromechanical actuator; electromechanical sensor; faulty behavior; folded-flexure comb-drive resonator; low-level mechanical simulations; microelectromechanical systems; quality; reliability; surface micromachined sensors; Actuators; Computer aided manufacturing; Electromechanical sensors; Mechanical sensors; Microelectromechanical systems; Micromechanical devices; Sensor phenomena and characterization; Surface contamination; Testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1997. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-4209-7
  • Type

    conf

  • DOI
    10.1109/TEST.1997.639707
  • Filename
    639707