DocumentCode
2754232
Title
Test Integration for SOC Supporting Very Low-Cost Testers
Author
Chi, Chun-Chuan ; Lo, Chih-Yen ; Ko, Te-Wen ; Wu, Cheng-Wen
Author_Institution
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2009
fDate
23-26 Nov. 2009
Firstpage
287
Lastpage
292
Abstract
To reduce test cost for SOC products, it is important to reduce the cost of testers. When using low-cost testers which have a limited test bandwidth to perform testing, built-in- self-test (BIST) is necessary to reduce the data volume to be transmitted between the tester and the device-under-test (DUT). We enhance the SOC test integration tool, STEAC, so that it can support SOCs containing BISTed cores which are to be tested by low-cost testers. A test chip is implemented to verify the proposed technique. Experimental results show that the enhanced STEAC successfully works with the HOY wireless test system and other low-cost testers.
Keywords
built-in self test; system-on-chip; BIST; SOC; STEAC; built-in- self-test; device-under-test; low-cost testers; test integration; wireless test system; Bandwidth; Built-in self-test; Circuit testing; Costs; Design for testability; Logic circuits; Logic testing; Performance evaluation; Probes; System testing; HOY; logic BIST; low-cost tester; test integration; wireless testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Test Symposium, 2009. ATS '09.
Conference_Location
Taichung
ISSN
1081-7735
Print_ISBN
978-0-7695-3864-8
Type
conf
DOI
10.1109/ATS.2009.51
Filename
5359330
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