• DocumentCode
    2754232
  • Title

    Test Integration for SOC Supporting Very Low-Cost Testers

  • Author

    Chi, Chun-Chuan ; Lo, Chih-Yen ; Ko, Te-Wen ; Wu, Cheng-Wen

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    23-26 Nov. 2009
  • Firstpage
    287
  • Lastpage
    292
  • Abstract
    To reduce test cost for SOC products, it is important to reduce the cost of testers. When using low-cost testers which have a limited test bandwidth to perform testing, built-in- self-test (BIST) is necessary to reduce the data volume to be transmitted between the tester and the device-under-test (DUT). We enhance the SOC test integration tool, STEAC, so that it can support SOCs containing BISTed cores which are to be tested by low-cost testers. A test chip is implemented to verify the proposed technique. Experimental results show that the enhanced STEAC successfully works with the HOY wireless test system and other low-cost testers.
  • Keywords
    built-in self test; system-on-chip; BIST; SOC; STEAC; built-in- self-test; device-under-test; low-cost testers; test integration; wireless test system; Bandwidth; Built-in self-test; Circuit testing; Costs; Design for testability; Logic circuits; Logic testing; Performance evaluation; Probes; System testing; HOY; logic BIST; low-cost tester; test integration; wireless testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Asian Test Symposium, 2009. ATS '09.
  • Conference_Location
    Taichung
  • ISSN
    1081-7735
  • Print_ISBN
    978-0-7695-3864-8
  • Type

    conf

  • DOI
    10.1109/ATS.2009.51
  • Filename
    5359330