DocumentCode :
2754646
Title :
Insertion Error in LPRT Temperature Measurements
Author :
Qu, Yan ; Puttitwong, Ekachai ; Howell, John R. ; Ezekoye, Ofodike A.
Author_Institution :
Mech. Eng. Dept., Texas, Univ., Austin TX
fYear :
2006
fDate :
10-13 Oct. 2006
Firstpage :
285
Lastpage :
292
Abstract :
Accurate measurement of surface temperature distribution is of great concern in the semiconductor industries, particularly in rapid thermal processing (RTP). The International Technology Roadmap for Semiconductors 2004 (ITRS) has established requirements of uncertainties of plusmn1.5 degC at temperature of 1000 degC, with temperature calibration traceable to ITS-90 (International Temperature Scale-1990). Light-pipe radiation thermometers (LPRTs) are becoming increasingly important as an industrial tool for temperature measurement, especially in the semiconductor industry. However, there are several radiation issues associate with LPRTs, and without fully understanding them, achieving further accuracy could be hobbled. In this paper, we concentrate on the insertion error in the LPRTs temperature measurement. The "drawdown effect" and "shadow effect" are investigated. The "drawdown effect" is caused by the physical mass of the light-pipe probe acting as a heat sink for the measured object and the "shadow effect" is caused by distortion of radiosity due to the presence of the light-pipe probe. Monte Carlo simulation was conducted and compared to the experiment results
Keywords :
Monte Carlo methods; heat sinks; measurement errors; rapid thermal processing; temperature measurement; thermometers; LPRT temperature measurements; Monte Carlo simulation; drawdown effect; heat sink; insertion error; light-pipe probe; light-pipe radiation thermometers; radiosity distortion; shadow effect; Distortion measurement; Electronics industry; Mechanical engineering; NIST; Probes; Rapid thermal processing; Temperature distribution; Temperature measurement; Testing; Thermal engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2006. RTP '06. 14th IEEE International Conference on
Conference_Location :
Kyoto
Print_ISBN :
1-4244-0648-X
Electronic_ISBN :
1-4244-0649-8
Type :
conf
DOI :
10.1109/RTP.2006.368012
Filename :
4223139
Link To Document :
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