DocumentCode :
2754697
Title :
Kiss the Scan Goodbye: A Non-scan Architecture for High Coverage, Low Test Data Volume and Low Test Application Time
Author :
Hsiao, Michael S. ; Banga, Mainak
Author_Institution :
Dept. of Electr. & Comput. Eng., Virginia Tech, Blacksburg, VA, USA
fYear :
2009
fDate :
23-26 Nov. 2009
Firstpage :
225
Lastpage :
230
Abstract :
Scan-based DFT is the de-facto industrial practice for testing integrated circuits (ICs). Variations in the scan architecture to improve test metrics have been the primary focus in recent years. In this paper, we propose a new nonscan DFT in which a subset of the circuit flip-flops are made directly loadable from the primary inputs and another subset of flip-flops are made observable at the output via a state compactor. In this architecture, multiple flip-flops may share the same primary input in the loading mode. A load-enable pin is added to distinguish the direct-loading mode from the functional mode. With a modest area overhead, this architecture offers several attractive features, including (1) at-speed testing, which eliminates the need for scan-shifting and would thus capture delay-related defects, (2) low test data volume and test application time, as we no longer need to store all the scan and response data, (3) high coverages, since the low-testability flipflops are made to be loadable and/or observable, and (4) low test power. Experimental results on large ISCAS´89 circuits validate the aforementioned metrics with 10× to 100× reduction in test application time with respect to Illinois Scan.
Keywords :
design for testability; flip-flops; logic testing; sequential circuits; circuit flip-flops; direct-loading mode; functional mode; nonscan DFT architecture; state compactor; test application time; test data volume; test power; Automatic test pattern generation; Circuit faults; Circuit testing; Clocks; Design for testability; Electrical fault detection; Fault detection; Flip-flops; Integrated circuit testing; Sequential circuits; DFT; Scan Architecture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Asian Test Symposium, 2009. ATS '09.
Conference_Location :
Taichung
ISSN :
1081-7735
Print_ISBN :
978-0-7695-3864-8
Type :
conf
DOI :
10.1109/ATS.2009.17
Filename :
5359350
Link To Document :
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