DocumentCode :
2754992
Title :
Why would an ASIC foundry accept anything less than full scan?
Author :
Oakland, Steven F.
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
fYear :
1997
fDate :
1-6 Nov 1997
Firstpage :
1031
Abstract :
A key force behind IBM´s growth in the application-specific integrated circuit (ASIC) market is the ability to sign off on multi-million-gate designs without requiring test vectors, presenting a savings in both time and money to customers. Once a customer ensures (via formal verification and/or functional simulation) that the design functions as required, static tinting analysis (STA) ensures that the design achieves the required performance targets. Extensive model-to-hardware correlation assures correctness of the timing analysis models, enabling IBM to assure that the design can be manufactured to the required performance targets. Through a combination of full-scan and boundary-scan design-for-test (DFT) structures, the IBM ASIC methodology ensures that automatically generated test patterns will run correctly on test equipment; typically achieving 99+% stuck-fault coverage. In the case of a repeatable manufacturing defect, full-scan-based diagnostic software isolates the problem without customer involvement
Keywords :
application specific integrated circuits; automatic testing; boundary scan testing; design for testability; economics; integrated circuit manufacture; integrated circuit testing; logic testing; production testing; ASIC; ASIC foundry; IBM; application-specific integrated circuit; boundary-scan DFT structures; design functions; full-scan DFT structures; model-to-hardware correlation; repeatable manufacturing defect; static tinting analysis; stuck-fault coverage; Analytical models; Application specific integrated circuits; Circuit simulation; Circuit testing; Design for testability; Formal verification; Foundries; Integrated circuit testing; Performance analysis; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1997. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-4209-7
Type :
conf
DOI :
10.1109/TEST.1997.639721
Filename :
639721
Link To Document :
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