• DocumentCode
    2755587
  • Title

    model order reduction for RLC interconnects using response dependent condensation

  • Author

    Ravindra, J.V.R. ; Srinivas, M.B.

  • Author_Institution
    Int. Inst. of Inf. Technol. (HIT), Gachibowli
  • fYear
    2007
  • fDate
    Oct. 30 2007-Nov. 2 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The continuous improvement in the performance and increase in the sizes of VLSI systems make electrical interconnect and package (EIP) design and modeling increasingly more important. Special software tools must be used for the design of high-performance VLSI systems. Furthermore, larger and faster systems require larger and more accurate circuit models. The model order reduction techniques are used for modeling such systems. This paper presents an efficient model order reduction method for large linear VLSI circuits using response-dependent condensation. Experimental results show that the effectiveness of the proposed technique. Significant reduction in computational expense is achieved as the size of the reduced equations is much less than that of the original system.
  • Keywords
    RLC circuits; VLSI; integrated circuit interconnections; integrated circuit packaging; RLC interconnects; circuit models; electrical interconnect and package design; linear VLSI circuits; model order reduction; response dependent condensation; response-dependent condensation; Capacitance; Circuit simulation; Computational modeling; Conductors; Frequency; Integrated circuit interconnections; Laplace equations; Linear circuits; RLC circuits; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2007 - 2007 IEEE Region 10 Conference
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-1272-3
  • Electronic_ISBN
    978-1-4244-1272-3
  • Type

    conf

  • DOI
    10.1109/TENCON.2007.4429084
  • Filename
    4429084