DocumentCode
2755587
Title
model order reduction for RLC interconnects using response dependent condensation
Author
Ravindra, J.V.R. ; Srinivas, M.B.
Author_Institution
Int. Inst. of Inf. Technol. (HIT), Gachibowli
fYear
2007
fDate
Oct. 30 2007-Nov. 2 2007
Firstpage
1
Lastpage
4
Abstract
The continuous improvement in the performance and increase in the sizes of VLSI systems make electrical interconnect and package (EIP) design and modeling increasingly more important. Special software tools must be used for the design of high-performance VLSI systems. Furthermore, larger and faster systems require larger and more accurate circuit models. The model order reduction techniques are used for modeling such systems. This paper presents an efficient model order reduction method for large linear VLSI circuits using response-dependent condensation. Experimental results show that the effectiveness of the proposed technique. Significant reduction in computational expense is achieved as the size of the reduced equations is much less than that of the original system.
Keywords
RLC circuits; VLSI; integrated circuit interconnections; integrated circuit packaging; RLC interconnects; circuit models; electrical interconnect and package design; linear VLSI circuits; model order reduction; response dependent condensation; response-dependent condensation; Capacitance; Circuit simulation; Computational modeling; Conductors; Frequency; Integrated circuit interconnections; Laplace equations; Linear circuits; RLC circuits; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON 2007 - 2007 IEEE Region 10 Conference
Conference_Location
Taipei
Print_ISBN
978-1-4244-1272-3
Electronic_ISBN
978-1-4244-1272-3
Type
conf
DOI
10.1109/TENCON.2007.4429084
Filename
4429084
Link To Document