Title :
Low dielectric constant new materials for multilayer ceramic substrate
Author :
Kata, Keiichiro ; Shimada, Yuzo ; Takamizawa, Hideo
Author_Institution :
NEC Corp., Kanagawa, Japan
Abstract :
A low-dielectric-constant glass-ceramic material system with improved thermal expansion coefficient and flexural strength is described. This material system consists of quartz glass, cordierite, and borosilicate glass. It can be sintered at temperatures below 1000°C, making it possible to use low-electrical-resistivity conductors, for example, Au, Ag, Ag-Pd, and Cu, as signal lines and interconnections. A dielectric constant in the 3.9 to 4.7 range can be realized. The thermal expansion coefficient can be controlled to match that of the chips carried. The flexural strength (2000 kg/cm2) is relatively high. Using green-sheet-lamination technology, a low-dielectric-constant multilayer glass-ceramic substrate with Ag-Pd wiring, suitable for use as a substrate for a high-speed VLSI multichip package, was developed
Keywords :
borosilicate glasses; ceramics; integrated circuit technology; packaging; permittivity; sintering; substrates; 1000 degC; Ag; AgPd wiring; Au; B2O3-SiO2; BSG; Cu; MLC; VLSI multichip package; borosilicate glass; cordierite; flexural strength; glass-ceramic material system; green-sheet-lamination technology; high-speed packages; low dielectric constant materials; multilayer ceramic substrate; quartz glass; sintering temperature; thermal expansion coefficient; Ceramics; Conducting materials; Dielectric constant; Dielectric materials; Dielectric substrates; Glass; Gold; Nonhomogeneous media; Temperature; Thermal expansion;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
DOI :
10.1109/IEMTS.1989.76102
