Title :
Manufacturing of complex systems by a discrete wiring interconnection technology
Author :
Nakahara, H. ; Messner, G. ; Buck, T.
Author_Institution :
Kollmorgen Corp., Melville, NY, USA
Abstract :
The authors describe the method and structures used to date in the production of high-performance mainframes and supercomputers, as well as some techniques proposed for the future. They analyze the main forces, needs, and constraints driving the selection of the methods presently used for manufacturing these computers. They assess the improved manufacturability of such systems which could be provided by the application of discrete wiring interconnection methods, specifically, the Microwire process. They provide wireability, electrical, and thermal performance data for Microwire boards and cite examples of their application to the manufacture of extremely dense, high-speed systems
Keywords :
digital computers; electronic equipment manufacture; packaging; printed circuits; Microwire process; circuit boards; complex systems; computers; crosstalk; discrete wiring; electrical performance; high density systems; high-performance mainframes; high-speed systems; interconnection technology; manufacturing; production; supercomputers; thermal performance data; wireability; Application specific integrated circuits; Atherosclerosis; Computer aided manufacturing; Costs; Electronics packaging; Equations; Integrated circuit interconnections; Integrated circuit packaging; Production; Wiring;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
DOI :
10.1109/IEMTS.1989.76106
