Applications of new assembly method `micron bump bonding method´

Author

Hatada, Kenzo ; Fujimoto, Hiroaki ; Ochi, Takao ; Ishida, Yuichiro

Author_Institution

Matsushita Electr. Ind. Co. Ltd., Osaka, Japan

fYear

1989

fDate

26-28 Apr 1989

Firstpage

45

Lastpage

48

Abstract

A novel LSI chip bonding method called the micron-bump bonding method was developed, making feasible micron-order direct bonding between the LSI electrode and the electrode provided on the circuit substrate. The shrinkage stress generated in light-setting insulating resin is utilized to apply a compressive force to an LSI chip, pressing it against the electrodes on the substrate. LSI chips having an interelectrode spacing of 10 μm and a total of 2320 electrodes were successfully gang-bonded with high reliability. This technology was also successfully applied to an LED array printer head

Keywords

integrated circuit manufacture; integrated circuit technology; large scale integration; lead bonding; surface mount technology; 10 micron; LED array printer head; LSI chip bonding; SMT; gang bonding; high reliability; light-setting insulating resin; microassembly; micron bump bonding method; surface mounting; Assembly; Bonding; Circuits; Compressive stress; Electrodes; Insulation; Large scale integration; Light emitting diodes; Pressing; Resins;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International

Conference_Location

Nara

Type

conf

DOI

10.1109/IEMTS.1989.76107

Filename

76107