Title :
Applications of new assembly method `micron bump bonding method´
Author :
Hatada, Kenzo ; Fujimoto, Hiroaki ; Ochi, Takao ; Ishida, Yuichiro
Author_Institution :
Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
Abstract :
A novel LSI chip bonding method called the micron-bump bonding method was developed, making feasible micron-order direct bonding between the LSI electrode and the electrode provided on the circuit substrate. The shrinkage stress generated in light-setting insulating resin is utilized to apply a compressive force to an LSI chip, pressing it against the electrodes on the substrate. LSI chips having an interelectrode spacing of 10 μm and a total of 2320 electrodes were successfully gang-bonded with high reliability. This technology was also successfully applied to an LED array printer head
Keywords :
integrated circuit manufacture; integrated circuit technology; large scale integration; lead bonding; surface mount technology; 10 micron; LED array printer head; LSI chip bonding; SMT; gang bonding; high reliability; light-setting insulating resin; microassembly; micron bump bonding method; surface mounting; Assembly; Bonding; Circuits; Compressive stress; Electrodes; Insulation; Large scale integration; Light emitting diodes; Pressing; Resins;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
DOI :
10.1109/IEMTS.1989.76107
