DocumentCode
2755970
Title
Solder paste inspection: process control for defect reduction
Author
Burr, Donald
Author_Institution
CyberOpt. Corp., USA
fYear
1997
fDate
1-6 Nov 1997
Firstpage
1036
Abstract
As quality control for SMT electronics assembly shifts from final inspection/final test to production line monitoring and process control, there is a greater emphasis on post-print solder paste inspection as a means of reducing the number of defects appearing on finished boards. Automatic post-print inspection systems provide operators with the continuous information required to implement in-line continuous process control, identifying out-of-spec trends so that printing problems can be corrected before defective boards are produced
Keywords
economics; inspection; printed circuit manufacture; printed circuit testing; process control; quality control; soldering; surface mount technology; PCB testing; SMT electronics assembly; automatic post-print inspection; defect reduction; defective boards; in-line continuous process control; process control; production line monitoring; quality control; Assembly; Contracts; Electronic equipment testing; Inspection; Monitoring; Printing; Process control; Production; Quality control; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1997. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-4209-7
Type
conf
DOI
10.1109/TEST.1997.639726
Filename
639726
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