Title :
Solder paste inspection: process control for defect reduction
Author_Institution :
CyberOpt. Corp., USA
Abstract :
As quality control for SMT electronics assembly shifts from final inspection/final test to production line monitoring and process control, there is a greater emphasis on post-print solder paste inspection as a means of reducing the number of defects appearing on finished boards. Automatic post-print inspection systems provide operators with the continuous information required to implement in-line continuous process control, identifying out-of-spec trends so that printing problems can be corrected before defective boards are produced
Keywords :
economics; inspection; printed circuit manufacture; printed circuit testing; process control; quality control; soldering; surface mount technology; PCB testing; SMT electronics assembly; automatic post-print inspection; defect reduction; defective boards; in-line continuous process control; process control; production line monitoring; quality control; Assembly; Contracts; Electronic equipment testing; Inspection; Monitoring; Printing; Process control; Production; Quality control; Surface-mount technology;
Conference_Titel :
Test Conference, 1997. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-4209-7
DOI :
10.1109/TEST.1997.639726
