Title :
A new packaging for DIP type thick film hybrid IC
Author :
Shibuya, Hitoshi ; Kusaba, Kazunori ; Iida, Saburo ; Handa, Tohru ; Kanazawa, Masaru
Author_Institution :
OKI Electr. Ind. Co. Ltd., Saitama, Japan
Abstract :
The authors discuss a novel packaging method for DIP-(dual-in-line package-) type thick-film hybrid ICs presently used in digital electronic exchange equipment. This method has replaced previous packaging methods due to its economy and high reliability and because it allows automation. The package structure consists of a dam component and a filler component of silicone resin. Thick-film hybrid ICs packaged with this silicone resin showed good resistance properties after 1000 hours of 60°C, 90% relative humidity, 175-V DC bias testing. The bonding resistance between substrate and parts was unchanged after 100 cycles of a -25°C to 85°C thermal shock test
Keywords :
circuit reliability; hybrid integrated circuits; integrated circuit technology; packaging; thick film circuits; -25 to 85 degC; 175 V; DIP type; bias testing; bonding resistance; dam component; dual-in-line; filler component; high reliability; packaging; silicone resin; thermal shock test; thick film hybrid IC; Digital integrated circuits; Electronic packaging thermal management; Electronics packaging; Hybrid integrated circuits; Integrated circuit packaging; Packaging machines; Resins; Testing; Thermal resistance; Thick films;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
DOI :
10.1109/IEMTS.1989.76110
