DocumentCode :
2757003
Title :
Design and technology challenges for sub-0.5 μm CMOS and bipolar
Author :
Ning, Tak H.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
1989
fDate :
17-19 May 1989
Firstpage :
307
Lastpage :
311
Abstract :
The design and technology problems that must be solved in order to realize the potential performance of sub-0.5-μm CMOS and bipolar devices are discussed. High-field and high-current-density effects are among the most important issues. The goal is to prevent these effects from becoming problems and yet achieve performance as expected from scaling. It is seen that there are no simple solutions. It is a matter of trading off performance with process complexity and/or reliability in an optimal manner. Scaling CMOS to about 50-nm channel length appears to be quite possible. However, scaling bipolar to much below 0.25 μm requires more understanding of the device physics and major technology breakthroughs
Keywords :
CMOS integrated circuits; VLSI; bipolar integrated circuits; circuit reliability; integrated circuit technology; 50 nm; CMOS; bipolar devices; channel length; device physics; high-current-density effects; process complexity; reliability; scaling; CMOS technology; Current density; Diodes; Inverters; MOS devices; MOSFET circuits; Photonic band gap; Power MOSFET; Power supplies; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on
Conference_Location :
Taipei
Type :
conf
DOI :
10.1109/VTSA.1989.68635
Filename :
68635
Link To Document :
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