DocumentCode :
2757239
Title :
Electrical resistivity characterization of silicon carbide by various methods
Author :
Bouanga, C. Vanga ; Savoie, S. ; Fréchette, M.F. ; Couderc, H. ; David, E.
Author_Institution :
Inst. de Rech. d´´Hydro-Quebec (IREQ), Varennes, QC, Canada
fYear :
2012
fDate :
10-13 June 2012
Firstpage :
43
Lastpage :
47
Abstract :
In this paper, the variation of the resistivity of SiC powder at low and high voltage as a function of milling time was investigated by controlling the particle size, morphology and compactness (applied pressure). The particle shape and size of commercially available SiC powders were altered by ball milling. The electrical properties of the various SiC powders were characterized at low voltage by using a pressure controlled ohmmeter and frequency-domain spectroscopy. A resistivity increase from 7 to 54 MΩ.cm was observed when the grinding time increased from 5 to 30 minutes, which corresponded to a decrease of the particle size from 54 μm to ~4.5 μm. The nonlinear characterization I-V for high electrical field was investigated. X-ray diffraction and scanning electron microscopy have been carried out to highlight the size decreasing and crystalline structure of the milled powder.
Keywords :
X-ray diffraction; ball milling; crystal structure; electrical resistivity; grinding; particle size; scanning electron microscopy; silicon compounds; spectroscopy; wide band gap semiconductors; SiC; X-ray diffraction; ball milling; crystalline structure; electrical resistivity; frequency domain spectroscopy; grinding time; milling time; particle shape; particle size; pressure controlled ohmmeter; scanning electron microscopy; silicon carbide; time 5 min to 30 min; Atmospheric measurements; Conductivity; Electrical resistance measurement; Materials; Milling; Powders; Silicon carbide; SiC powder; X-ray diffraction; ball milling; electrical properties; resistivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation (ISEI), Conference Record of the 2012 IEEE International Symposium on
Conference_Location :
San Juan, PR
ISSN :
1089-084X
Print_ISBN :
978-1-4673-0488-7
Electronic_ISBN :
1089-084X
Type :
conf
DOI :
10.1109/ELINSL.2012.6251423
Filename :
6251423
Link To Document :
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