• DocumentCode
    2757264
  • Title

    Dielectric properties of UV-cured epoxy films treated with Layer-by-Layer nanosilica architectures

  • Author

    Bouanga, C. Vanga ; Couderc, H. ; Fréchette, M.F. ; Savoie, S. ; Malucelli, G. ; Camino, G. ; Carosio, F.

  • Author_Institution
    Inst. de Rech. d´´Hydro-Quebec (IREQ), Varennes, QC, Canada
  • fYear
    2012
  • fDate
    10-13 June 2012
  • Firstpage
    59
  • Lastpage
    63
  • Abstract
    This paper focuses on the preparation and characterization of hybrid organic-inorganic epoxy systems obtained through the application of a Layer by Layer (LbL) assembly on a UV-cured epoxy coating. To this aim, a mixture 90/10 (wt.%) of 3,4-epoxycyclohexylmethyl-3\´,4"-epoxy-cyclo-hexane carboxylate (CE)/diglycidylether-terminated polydi-methyl-siloxane (GTPDMS) was subjected to LbL deposition of 10 and 20 bilayers of silica (positively charged/negatively charged). The relationship between the dielectric properties and transition temperature (Tg) were investigated. Two dielectric relaxation modes namely α and β were observed, attributed to the molecular motions of the polymer chains. The breakdown voltage decreased with increasing number of nanosilica bilayers deposited.
  • Keywords
    coatings; curing; dielectric relaxation; dielectric thin films; glass transition; nanostructured materials; organic-inorganic hybrid materials; polymer films; resins; silicon compounds; 3,4-epoxycyclohexylmethyl-3´,4´-epoxy-cyclo-hexane carboxylate; LbL assembly; SiO2; UV-cured epoxy coating; UV-cured epoxy film; breakdown voltage; dielectric properties; dielectric relaxation; diglycidylether-terminated polydimethyl-siloxane; glass transition temperature; hybrid organic-inorganic epoxy systems; layer-by-layer nanosilica architecture; molecular motion; polydi-methyl-siloxane; polymer chain; Dielectrics; Films; Heating; Permittivity; Polymers; Temperature measurement; UV-curing; dielectric properties; epoxy monomers; glass transition temperature; nanosilica;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation (ISEI), Conference Record of the 2012 IEEE International Symposium on
  • Conference_Location
    San Juan, PR
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4673-0488-7
  • Electronic_ISBN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.2012.6251426
  • Filename
    6251426