A computational method of temperature distribution in high frequency planar transformers

In high frequency planar transformers and inductors, conventional wires have been replaced by printed circuit boards or laminated copper windings. This technology can outperform traditional wire-wound transformers in terms of cost, dimensions and performance. However, in order to obtain high efficiency and high power/size ratio, their design requires the knowledge of the internal temperature distribution. For such a reason, this paper proposes a two-dimensional numerical method for a combined computation of both the temperature distribution and the electromagnetic behaviour of planar transformers and inductors. After a detailed description of the proposed methodology, this paper reports, compares and analyzes calculated and measured results demonstrating prediction capabilities of the proposed method.