Title :
FMEA without fear AND tear
Author :
Suganthi, S. ; Kumar, D.
Author_Institution :
Dept. of Electron. & Commun. Eng., Shri Angalamman Coll. of Eng. & Technol., Tiruchirappalli, India
Abstract :
This paper aims at applying simplified FMEA (Failure Modes and Effects Analysis), to electronic products for better quality. The procedure has five important steps. Studying the product and identifying failure modes are the pre-work and performing, analyzing and continuing FMEA remain the post-work. In SSIs(small scale industries), the work nature creates fear on use of detailed FMEA among employees. Adapting sophisticated software is beyond the budget of such industries. If FMEA is willingly performed in all stages, it might lead to tear due to limitations. Though flexible, its enlarged application throughout, requires skilled employees, more time, money and effort. The proposed modeling enunciated SIPAC(study, identify, perform, analyze and continue) provides solution, being simple and sleek based on needs of SSIs.
Keywords :
electronic products; failure analysis; FMEA; SIPAC modeling; effects analysis; electronic products; failure modes; Application software; Computer industry; Condition monitoring; Consumer electronics; Educational institutions; Failure analysis; Performance analysis; Process design; Risk analysis; Software maintenance; CI; Check sheet; DUA; FMEA; RPN; SIPAC modeling; Success%; fmea table (excel worksheet);
Conference_Titel :
Management of Innovation and Technology (ICMIT), 2010 IEEE International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-6565-1
Electronic_ISBN :
978-1-4244-6566-8
DOI :
10.1109/ICMIT.2010.5492899
