مرکز منطقه ای اطلاع رساني علوم و فناوري - A Mixed Solder Grid Array And Peripheral Leaded Mcm Package

DocumentCode :

2758013

Title :

A Mixed Solder Grid Array And Peripheral Leaded Mcm Package

Author :

Hashemi, Hassan ; Olla, Mike ; Cobb, Deborah ; McShane, Mike ; Hawkins, George ; Lin, Paul

fYear :

1993

fDate :

9-11 Jun 1993

Firstpage :

141

Lastpage :

145

Keywords :

Assembly; Bonding; Costs; Electronics packaging; Integrated circuit interconnections; Lead; Multichip modules; Printed circuits; Testing; Wire;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN :

0-7803-1432-8

Type :

conf

DOI :

10.1109/IEMT.1993.639736

Filename :

639736

Link To Document :