A Mixed Solder Grid Array And Peripheral Leaded Mcm Package

Author

Hashemi, Hassan ; Olla, Mike ; Cobb, Deborah ; McShane, Mike ; Hawkins, George ; Lin, Paul

fYear

1993

fDate

9-11 Jun 1993

Firstpage

141

Lastpage

145

Keywords

Assembly; Bonding; Costs; Electronics packaging; Integrated circuit interconnections; Lead; Multichip modules; Printed circuits; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

DOI

10.1109/IEMT.1993.639736

Filename

639736

Link To Document