• DocumentCode
    2758014
  • Title

    Quantifying the operational benefits of new HV cable systems in terms of dielectric design parameters

  • Author

    Pilgrim, J.A. ; Lewin, P.L. ; Vaughan, A.S.

  • Author_Institution
    Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
  • fYear
    2012
  • fDate
    10-13 June 2012
  • Firstpage
    261
  • Lastpage
    265
  • Abstract
    In recent years, a significant volume of work has been undertaken on the development of novel dielectric materials which offer improvements in a variety of properties. Questions are frequently asked as to how particular properties can be improved by more intelligent dielectric design. However from the point of view of the network operator it is not just the dielectric design which is of interest - rather, how the finished product performs in the network. This paper seeks to demonstrate what quantifiable improvements in cable performance could be gained through advances in the dielectric properties of cable systems. The analysis is set in the context of the operational current rating of the cable circuit and the associated losses per unit of power transferred. Analysis of the results shows that the greatest improvement in cable operational performance can be made from increasing the dielectric thermal conductivity, even if it comes at the expense of a slight decrease in other properties.
  • Keywords
    dielectric materials; dielectric properties; power cables; thermal stability; HV cable systems; cable circuit; dielectric design parameter; dielectric material development; dielectric properties; dielectric thermal conductivity; intelligent dielectric design; operational current rating; Cable insulation; Conductivity; Conductors; Dielectric losses; Thermal conductivity; Thermal resistance; current rating; dielectric design; transmission cables;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation (ISEI), Conference Record of the 2012 IEEE International Symposium on
  • Conference_Location
    San Juan, PR
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4673-0488-7
  • Electronic_ISBN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.2012.6251469
  • Filename
    6251469