Title :
Design of Hyper Elliptic Curve Digital Signature
Author :
Jian-Zhi, Deng ; Xiao-Hui, Cheng ; Qiong, Gui
Author_Institution :
Dept. of Electron. & Comput. Sci., Guilin Univ. of Technol., Guilin, China
Abstract :
In computer cryptography, hyper elliptic curve cryptography system is one of the best cryptography system. DSA signature algorithm is also an advanced digital signature algorithm. In this paper, itpsilas banded hyper elliptic curve cryptography system and DSA signature standard together based on analysis and study them. The digital signature algorithm and the digital validate algorithm are analysis and improved. The hyper elliptic curve cryptography system is transplanted into DSA algorithm. And a digital signature based on HEC-DSA system is implemented. QuartusII is used to generate the function modules, RTL circuit and simulated waveform. RTL is the circuit connection in chip. It shows the connection of the modules. Simulated waveform shows us the timing and the function of the system. The security and efficiency of the HEC-DSA digital signature system is analyzed. The digital signature designed in this paper can solved the problem that how to check integrality of the file and signature ID, and it especially fit for the Internet operation that need identity validate.
Keywords :
digital signatures; public key cryptography; HEC-DSA system; Internet; QuartusII; advanced digital signature algorithm; computer cryptography; digital validate algorithm; file integrity; hyper elliptic curve cryptography system; hyper elliptic curve digital signature; signature ID; Circuits; Computer science; Digital arithmetic; Digital signatures; Elliptic curve cryptography; Elliptic curves; Information technology; Jacobian matrices; Polynomials; Security; digital signature; digital signature algorithm; hyper elliptic curve; secure hash algorithm;
Conference_Titel :
Information Technology and Computer Science, 2009. ITCS 2009. International Conference on
Conference_Location :
Kiev
Print_ISBN :
978-0-7695-3688-0
DOI :
10.1109/ITCS.2009.146