• DocumentCode
    27584
  • Title

    EMI Measurements, Modeling, and Reduction of 32-Bit High-Performance Microcontrollers

  • Author

    Leca, Jean Pierre ; Froidevaux, Nicolas ; Dupre, Philippe ; Jacquemod, Gilles ; Braquet, Henri

  • Author_Institution
    STMicroelectron., Rousset, France
  • Volume
    56
  • Issue
    5
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    1035
  • Lastpage
    1044
  • Abstract
    This paper presents a full electromagnetic interference (EMI) study of high-performances 32-bit microcontrollers (MCU). First, two types of standard radiated emissions measurements have been executed on a device. Then, EMI modeling has been simulated with the help of a predictive SPICE model. Finally, modifications has been studied and implemented in order to reduce the EMI levels. The aim of this paper is to be able to predict, during the design stage, the level of electromagnetic emissions in order to establish design, layout, or packaging rules. The modeling part, which is the most important, is intended to represent the EMI behavior of a microcontroller when it is running in a noisy mode (reading accesses to the embedded nonvolatile memory Flash memory and CPU running). The simulated results have then been correlated with radiated emission measurements. All measurements are following the International Electrotechnical Commission 61967-2 or 61967-3 standards whereas the model has been simulated by the ELDO simulator.
  • Keywords
    SPICE; electromagnetic interference; flash memories; integrated circuit design; integrated circuit packaging; microcontrollers; random-access storage; system-on-chip; 32-bit high-performance microcontrollers; CPU running; ELDO simulator; EMI level reduction; EMI measurements; EMI modeling; International Electrotechnical Commission 61967-2 standard; International Electrotechnical Commission 61967-3 standard; MCU; complex system-on-chip; design rules; electromagnetic emissions; electromagnetic interference; embedded nonvolatile memory flash memory; layout rules; noisy mode; packaging rules; predictive SPICE model; standard radiated emission measurements; Ash; Clocks; Electromagnetic interference; Integrated circuit modeling; Microcontrollers; Probes; Switches; EMI measurements; Electromagnetic compatibility; electromagnetic interference (EMI); electromagnetic modeling; microcontrollers (MCU); power distribution network;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2014.2304744
  • Filename
    6763015