DocumentCode
2759019
Title
Non destructive testing of high voltage cables by non-electrical methods
Author
Fourmigue, Jean-Marie
Author_Institution
Res. & Dev. Div., Electr. de France, Moret-sur-Loing, France
Volume
1
fYear
1996
fDate
16-19 Jun 1996
Firstpage
167
Abstract
Today, many electrical methods such as partial discharges detection and high voltage breakdown tests yield fruitful information on power cable insulation quality and have been performed by most manufacturers as quality control tests. The authors have investigated the capability of conventional nondestructive testing (NDT) methods to detect these defects just after processing, i.e., before the metallic shield and the polymeric jacket are added to the cable. Three methods have been investigated: X-ray tomography; ultrasonic testing; and thermography. The three methods were tested on high voltage cables in which artificial defects were previously inserted. These defects simulate voids and metallic contaminants. The first step of investigations was carried on defects with a size of at least 300 μm. In this paper, the three methods are presented and discussed. The results obtained are then detailed as well as the possible applications of these techniques for processing, quality control and qualification purposes
Keywords
electric breakdown; infrared imaging; insulation testing; nondestructive testing; partial discharges; power cable insulation; power cable testing; power cables; quality control; ultrasonic materials testing; X-ray tomography; artificial defects; breakdown tests; high-voltage power cables; metallic contaminants; nondestructive insulation testing; partial discharges detection; power cable insulation quality; quality control tests; thermography; ultrasonic testing; voids; Dielectric breakdown; Insulation testing; Manufacturing; Nondestructive testing; Partial discharges; Performance evaluation; Polymers; Power cable insulation; Quality control; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 1996., Conference Record of the 1996 IEEE International Symposium on
Conference_Location
Montreal, Que.
ISSN
1089-084X
Print_ISBN
0-7803-3531-7
Type
conf
DOI
10.1109/ELINSL.1996.549309
Filename
549309
Link To Document