• DocumentCode
    2759226
  • Title

    Characterization of XLPE cable insulation by dynamic mechanical thermal analyzer (DMTA)

  • Author

    Parpal, J.-L. ; Guddemi, C. ; Lamarre, L.

  • Author_Institution
    Inst. de Recherche, Hydro-Quebec, Varennes, Que., Canada
  • Volume
    1
  • fYear
    1996
  • fDate
    16-19 Jun 1996
  • Firstpage
    171
  • Abstract
    Polymeric insulated cables and accessories are becoming widely used at voltages over 120 kV, even up to 500 kV. Although high electrical stress presents the greatest challenge, some attention should be given to the fact that the polymeric insulation is also subjected to mechanical stress which can affect the electrical performance of the high-voltage cable system. Thus, the mechanical response to an AC stress induced by oscillating electrostatic forces could be an important factor with regard to long-term degradation of polymeric insulation. This paper presents preliminary mechanical relaxation measurements on XLPE and LDPE specimens taken from unaged transmission type cables. Dynamic mechanical relaxation showing radial profiles of the mechanical loss tangent and tensile modulus E´ are presented in a temperature range of 40 to 120°C
  • Keywords
    XLPE insulation; ageing; anelastic relaxation; electric breakdown; power cable insulation; power cables; thermal analysis; 40 to 120 C; LDPE; XLPE; XLPE cable insulation characterisation; dynamic mechanical relaxation; dynamic mechanical thermal analyzer; electrical performance; electrical stress; long-term degradation; mechanical loss tangent; mechanical relaxation measurements; oscillating electrostatic forces; polymeric insulation; radial profiles; tensile modulus; Cable insulation; Dielectrics and electrical insulation; Electrostatic measurements; Mechanical cables; Mechanical variables measurement; Plastic insulation; Polymers; Tensile stress; Thermal degradation; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1996., Conference Record of the 1996 IEEE International Symposium on
  • Conference_Location
    Montreal, Que.
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-3531-7
  • Type

    conf

  • DOI
    10.1109/ELINSL.1996.549310
  • Filename
    549310