Differential power combining technique for general power amplifiers using lumped component network

Author

Chang, Huan-Lin ; Lin, Po-Tsung ; Hua, Wei-Chun ; Lin, Chun-Ping ; Lin, Che-Yung ; Liu, Chee Wee ; Yang, Tzu-Yi ; Ma, Gin-Kou

fYear

2006

fDate

12-15 Dec. 2006

Firstpage

500

Lastpage

503

Abstract

A differential power combining method for general power amplifiers (PAs) with combining and matching network using lumped components is proposed for the first time. The proposed power combining technique greatly reduces board area at 1.95 GHz as compared to the traditional in-phase power combining method using transmission line, such as Wilkinson power combiners. The output matching is achieved with smaller impedance transformation ratio and the matching loss is reduced. The proposed SiGe PA with power combining technique achieves 28 dBm output power, 14 dB gain and 22.6% power-added efficiency (PAE) at 1.95 GHz with 1dB output power enhancement as compared to the single PA.

Keywords

Ge-Si alloys; UHF integrated circuits; UHF power amplifiers; impedance matching; lumped parameter networks; power combiners; GeSi; Wilkinson power combiners; combining network; differential power combining; efficiency 22.6 percent; frequency 1.95 GHz; gain 14 dB; general power amplifiers; in-phase power combining; lumped component network; matching network; transmission line; Differential amplifiers; Germanium silicon alloys; Impedance; Microwave technology; Power amplifiers; Power combiners; Power generation; Power transmission lines; Radio frequency; Silicon germanium; differential power combining; impedance transformation ratio; lumped component network; matching loss; power amplifiers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2006. APMC 2006. Asia-Pacific

Conference_Location

Yokohama

Print_ISBN

978-4-902339-08-6

Electronic_ISBN

978-4-902339-11-6

Type

conf

DOI

10.1109/APMC.2006.4429472

Filename

4429472