DocumentCode :
2759468
Title :
Application of aluminium-alloy ultrahigh vacuum system to semiconductor device fabrication processes
Author :
Suemitsu, Maki ; Miyamoto, Nobuo
Author_Institution :
Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
fYear :
1989
fDate :
26-28 Apr 1989
Firstpage :
172
Lastpage :
175
Abstract :
The aluminium-alloy ultra-high-vacuum (UHV) system has been shown to possess several excellent vacuum properties, such as an extremely low outgassing rate and an extremely short pumpdown time to reach the UHV region. It has, therefore, a considerable potential as a UHV system for next-generation semiconductor processes. For this application, however, proper surface treatments must be applied to the inner surface of the chamber, depending on the environment created by the process. A lathing method that utilizes alcohols as the lathing liquid has been developed for this purpose and found to be effective for processes that do not contain corrosive species. A silicon molecular beam epitaxy (MBE) chamber has been constructed with this method, and its vacuum properties were tested. For processes that contain corrosive species, ceramic coating was tested and found effective
Keywords :
molecular beam epitaxial growth; semiconductor growth; semiconductor technology; vacuum apparatus; vacuum techniques; corrosive species; lathing method; molecular beam epitaxy; outgassing rate; pumpdown time; semiconductor device fabrication processes; surface treatments; ultrahigh vacuum system; Aluminum alloys; Fabrication; Molecular beam epitaxial growth; Semiconductor devices; Semiconductor materials; Surface treatment; Testing; Thermal conductivity; Vacuum systems; Vacuum technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
Type :
conf
DOI :
10.1109/IEMTS.1989.76132
Filename :
76132
Link To Document :
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