Abstract :
The following topics are dealt with: quality electronic design; packaging; signal integrity; analog IC design; efficient testing; high performance memory; logic circuit; MEMS; biochips; on-chip interconnection; statistical timing; leakage analysis; noise analysis; fault detection; fault correction; nanoelectronic device; VLSI architecture; sensor; and display.
Keywords :
VLSI; electronics packaging; integrated circuit design; lab-on-a-chip; logic circuits; micromechanical devices; nanoelectronics; sensors; MEMS; VLSI architecture; analog IC design; biochips; display; efficient testing; fault correction; fault detection; high performance memory; leakage analysis; logic circuit; nanoelectronic device; noise analysis; on-chip interconnection; packaging; quality electronic design; sensor; signal integrity; statistical timing;
Conference_Titel :
Quality Electronic Design (ASQED), 2011 3rd Asia Symposium on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4577-0145-0
DOI :
10.1109/ASQED.2011.6111684
