Experimental Analytical Study Of Fine Pitch Qfp Solder-joint Reliability

Author

Kojima, Yasushi ; Sakiura, Jun ; Matsunaga, Katsuki

fYear

1993

fDate

9-11 Jun 1993

Firstpage

181

Lastpage

182

Keywords

Circuits; Electric shock; Electronics packaging; Lead; Performance evaluation; Printing; Sliding mode control; Soldering; Testing; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

DOI

10.1109/IEMT.1993.639745

Filename

639745

Link To Document