Title :
Experimental Analytical Study Of Fine Pitch Qfp Solder-joint Reliability
Author :
Kojima, Yasushi ; Sakiura, Jun ; Matsunaga, Katsuki
Keywords :
Circuits; Electric shock; Electronics packaging; Lead; Performance evaluation; Printing; Sliding mode control; Soldering; Testing; Thermal stresses;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639745
