Power semiconductor solutions for hybrid-electric and electric vehicles

The aim of this paper is to give an overview of the power semiconductor solutions for the hybrid electric vehicles, as based on the technologies existing today. First, the motivation for the electric vehicles is given, followed by the brief system overview. After that, the application specifics are discussed and mapped directly into power semiconductor requirements. Special attention is given to the IGBT based power modules. Based on the specific application a different module power ratings and technologies are proposed. A solution overview of both front-end (silicon chip) and back-end (packaging) technologies is given. Next point is the investigation of packaging and interconnection options, with quality and reliability of power modules in the focus. In the end, a future outlook, including ultra low module inductance, ultra thin wafer and SiC technology is given.