Single Point Outer Mad Bonding Technology For High Pin Count Ceramic PGA

Author

Ando, Tetsuo ; Tomioka, Taizo ; Nakaz, Masakazu ; Atsumi, Ono Koichiro ; Tane, Yasuo ; Nakano, Jiro ; Hirata, Seiichi

fYear

1993

fDate

9-11 Jun 1993

Firstpage

183

Lastpage

186

Keywords

Bonding forces; Ceramics; Conducting materials; Copper; Electrodes; Electronics packaging; Gold; Lead; Nickel; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

DOI

10.1109/IEMT.1993.639747

Filename

639747

Link To Document