Ultrawide-band integrated circuit package antenna in LTCC technology

A compact ultrawide-band (UWB) integrated circuit package antenna (ICPA) with a small footprint of 6.18times11.35 mm² has been designed for the fist time in a 20times10times1.2 mm³ low-temperature cofired ceramic (LTCC) package format with feeding network and the transceiver chip loaded. The chip-package co-EM simulation method is used. A design procedure based on the return loss parameter is illustrated. The measured UWB antenna without integration confirms its UWB impedance matching from 3.5 GHz to 10.2 GHz. Whereas the simulated UWB antenna in integration achieves a -10-dB impedance bandwidth of 6.7 GHz which covers the upper UWB band from 5.05 to 11.75 GHz with available radiation patterns. It also achieves the radiation efficiency of >96% and the gain of 2.5 to 4.3 dBi over the simulated UWB frequency range. The results and design guidelines of UWB ICPA presented are useful and inspiring for engineers interested in the single package UWB radio implementation.