• DocumentCode
    2760236
  • Title

    Random work functions induced DC and dynamic characteristic fluctuations in 16-nm high-κ/metal gate CMOS device and digital circuit

  • Author

    Cheng, Hui-Wen ; Li, Yiming

  • Author_Institution
    Inst. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    19-20 July 2011
  • Firstpage
    203
  • Lastpage
    206
  • Abstract
    We study nanosized metal grains induced DC and timing fluctuations in 16 nm high-κ/metal gate (HKMG) MOSFET devices. A localized work function fluctuation (LWKF) on device´s DC/AC and CMOS inverter´s characteristics is advanced using an experimentally validated 3D device simulation which cannot be well modeled using an averaged WKF (AWKF) method. DC characteristics estimated by the LWKF method are 1.5 and 1.6 times larger than that by the AWKF method for N- and P-MOSFETs, respectively, due to random grain number and position effects. The delay time of high-to-low and low-to-high of the CMOS inverter calculated by the AWKF method are underestimated by 1.29 and 1.19 times, compared with the LWKF method.
  • Keywords
    CMOS integrated circuits; MOSFET; digital circuits; high-k dielectric thin films; invertors; N-MOSFET; P-MOSFET; averaged WKF method; delay time; device DC-AC characteristics; digital circuit; high-κ-metal gate CMOS device; inverter characteristics; localized work function fluctuation; localized work function fluctuation method; position effects; random grain number; random work functions induced DC fluctuations; size 16 nm; CMOS integrated circuits; Fluctuations; Integrated circuit modeling; Logic gates; MOSFET circuits; Tin; 16-nm-gate MOSFET; Localized work function fluctuation method; average work function fluctuation method; grain orientation; high-κ/ metal gate; nanosized metal grain; three-dimensional device simulation; threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ASQED), 2011 3rd Asia Symposium on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4577-0145-0
  • Type

    conf

  • DOI
    10.1109/ASQED.2011.6111745
  • Filename
    6111745