Title :
Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs
Author :
Dembla, Ashish ; Zhang, Yue ; Bakir, Muhannad S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Future high performance 3D systems require a systematic co-design of their electrical interconnect network and their heat removal mechanism. This paper presents fine pitch (20μm) and high aspect ratio (18:1) TSVs integrated in a micropin-fin heat sink capable of removing power density of 100W/cm2 and resulting in junction temperatures below 50°C.
Keywords :
elemental semiconductors; heat sinks; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; silicon; three-dimensional integrated circuits; 3D IC; Si; electrical interconnect network; fine pitch TSV integration; heat removal mechanism; junction temperature; micropin-fin heat sink; power density; size 20 mum; systematic codesign; Heat sinks; Junctions; Resistance; Resistance heating; Silicon; Temperature measurement; Through-silicon vias;
Conference_Titel :
Interconnect Technology Conference (IITC), 2012 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1138-0
Electronic_ISBN :
pending
DOI :
10.1109/IITC.2012.6251587
