• DocumentCode
    2760354
  • Title

    Phase Change Memories challenges: A material and process perspective

  • Author

    Maitrejean, S. ; Ghezzi, G. ; Gourvest, E. ; Beneventi, G. Betti ; Fantini, A. ; Pashkov, N. ; Navarro, G. ; Roule, A. ; Fillot, F. ; Noé, P. ; Lhostis, S. ; Cueto, O. ; Jahan, C. ; Nodin, JF ; Persico, A. ; Armand, M. ; Dussault, L. ; Vallé, C. ; Michall

  • Author_Institution
    LETI, CEA, Grenoble, France
  • fYear
    2012
  • fDate
    4-6 June 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Among all the new memories concepts, Phase Change Memories (PCM) is one of the most promising. However, various challenges remain. This paper reviews the materials and processes required to face these challenges. As an example, attention will be made on the effect of Phase change material composition on stability of the amorphous phase i.e. on the retention of the information. Additionally, it is showed how specific processes such as CVD or ALD can be developed in order to minimize the current required to amorphize the phase change material i.e. to reset the device. Finally, with the perspectives of the advanced integration nodes, experimental results on the effect of scaling on phase transformation are presented and discussed.
  • Keywords
    phase change materials; phase change memories; ALD; CVD; PCM; advanced integration nodes; phase change material composition; phase change memories; phase transformation; Crystallization; Films; Phase change materials; Phase change memory; Switches; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference (IITC), 2012 IEEE International
  • Conference_Location
    San Jose, CA
  • ISSN
    pending
  • Print_ISBN
    978-1-4673-1138-0
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/IITC.2012.6251591
  • Filename
    6251591