مرکز منطقه ای اطلاع رساني علوم و فناوري - Pin Brazing Technology For A High Performance Aluminum Nitride Package

DocumentCode :

2760652

Title :

Pin Brazing Technology For A High Performance Aluminum Nitride Package

Author :

Iyogi, K. ; Yamakawa, K. ; Koiwa, K. ; Yasumoto, T. ; Matsu-ura, T. ; Endo, M. ; Iwase, N.

fYear :

1993

fDate :

9-11 Jun 1993

Firstpage :

192

Lastpage :

195

Keywords :

Adhesives; Aluminum nitride; Gold; Land surface; Packaging; Pins; Residual stresses; Rough surfaces; Surface roughness; Transistors;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN :

0-7803-1432-8

Type :

conf

DOI :

10.1109/IEMT.1993.639750

Filename :

639750

Link To Document :