Measurement-based modeling of microwave transistor package and test-fixture for device S-parameter deembedding

The problem of deembedding microwave transistor S-parameter measurements from the contribution of both package and test-fixture parasitics is addressed. In particular, a measurement-based approach is presented, which permits one to identify, in a step-by-step and reliable manner, all the elements of the equivalent circuit that models the overall chip-embedding fourport network. To achieve this goal, a direct extraction method is employed that makes use of purposely realized passive test devices. The experimental results presented, pertaining to a 100 mil-package device characterized using a coaxial test-fixture, show that accurate deembedded measurements can be obtained by the proposed method up to at least 18 GHz