• DocumentCode
    2761202
  • Title

    Molding Compound Trends In A Denser Packaging World. I. Technology Evolution

  • Author

    Nguyen, L.T. ; Lo, R.H.Y. ; Belimi, J.G.

  • fYear
    1993
  • fDate
    9-11 Jun 1993
  • Firstpage
    204
  • Lastpage
    212
  • Keywords
    Application specific integrated circuits; Batteries; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Portable computers; Semiconductor device packaging; Thermal expansion; Thermal resistance; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
  • Print_ISBN
    0-7803-1432-8
  • Type

    conf

  • DOI
    10.1109/IEMT.1993.639753
  • Filename
    639753
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2761202