Title :
High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via
Author :
Guo, Yong-Xin ; Chu, Hui
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
Abstract :
In this paper, the through silicon via (TSV) technology is employed to design millimeter-wave substrate integrated waveguide (SIW) based on-chip antennas. The TSV based SIW is first characterized with different silicon resistivity, substrate thickness and via pitch size. Then a high-efficiency TSV based SIW antenna is demonstrated.
Keywords :
millimetre wave antennas; monolithic integrated circuits; substrate integrated waveguides; waveguide antennas; SIW antenna; TSV technology; millimeter wave substrate integrated waveguide; silicon on-chip antennas; silicon resistivity; through silicon via technology;
Conference_Titel :
Ultra-Wideband (ICUWB), 2010 IEEE International Conference on
Conference_Location :
Nanjing
Print_ISBN :
978-1-4244-5305-4
Electronic_ISBN :
978-1-4244-5306-1
DOI :
10.1109/ICUWB.2010.5615804
